Woodworking panel adhesive is often used in our daily learning and living environment, but when we use woodworking panel adhesive, we can also use methods and techniques. Below I will introduce to you the usage techniques for woodworking splicing adhesive.

What are the techniques for using woodworking splicing adhesive?
1. The moisture content of the wood for woodworking splicing adhesive should be controlled between 8% and 15% to achieve better bonding.
2. Before preparing the adhesive, prepare the pressing equipment, cleaning tools, and moisture-proof tools.
3. The ratio of woodworking splicing adhesive to curing agent must be thoroughly stirred. It is recommended to be as precise as possible when measuring the ratio.
4. The small mixing ratio of woodworking splicing adhesive to curing agent is 10:0.5 to 10:1. Stir throughout the day, but the more thorough the better. Use within about 4 hours. Micro bubbles can be continuously used when bubbles form normally. If there are too many bubbles, discard. Clean the wood thoroughly before use.
5. When applying adhesive, these surfaces must be coated evenly. During adhesive application, the processing speed of the panels and the pressure system should be very fast, otherwise a long time will cause surface curing.
6. The backing panel must have adhesive flow. Abnormal adhesive flow easily leads to glue line opening. If the panel is larger, apply a thicker layer to prevent surface curing. The adhesive amount is about 300g/m².
7. After removing the adhesive or curing agent from the packaging, properly seal the mixing bag or lid to avoid prolonged exposure to air, which could cause.
8. Press evenly to develop pressure. Pressure: softwood 6-10 kg/cm², hardwood 10-15 kg/cm².
9. Small area panels can be unloaded within 2 hours, large area panels within 5 hours. The longer the pressure is released, the better.
10. For tools cleaned with water, such as preparing multiple sets of tools (e.g., washing heads, drums), the water content of the cleaned tools will not affect performance.